Dolphin0606FDI kugadzirwa imhando yakagadziriswa uye yakaderera ruzha x-ray flat panel detector yakavakirwa paCMOS.CMOS masensa anoshandisa imwechete crystal silicon maitiro ekugadzira chip.Yakananga kusanganisa kukwidziridzwa mukati memaseru epixel inotungamira kukudzikira kwemagetsi ruzha, yakakwira chiratidzo-kune-ruzha chiyero, uye yakakwira quantum yekuona zvakanaka (DQE) pane amorphous silicon, saka masensa eCMOS anonyanya kukodzera kune yakaderera-dose yekufungidzira mamiriro.Kubva pane hunhu huri pamusoro, Dolphin0606FDI detector inogona kushandiswa zvakanyanya muindasitiri SMT, zvemagetsi, lithium bhatiri uye chip waya bonding inspection.
Ruzha rwemagetsi rwakaderera
Yepamusoro chiratidzo-kune-ruzha reshiyo
Vadivelu Comedy Technology | |
Sensor | CMOS |
Scintillator | CSI |
Active Area | 60 x 53.5 mm |
Pixel Matrix | 1200 x 1056 |
Pixel Pitch | 50 μm |
AD Shanduko | 14 bits |
Interface | |
Communication Interface | Optical Fiber |
Exposure Control | Pulse Sync Mu (Edge kana Level) / Pulse Sync Out (Edge kana Level) |
Work Mode | Software Mode / HVG Sync Mode / FPD Sync Mode |
Frame Speed | 51fps (1x1) |
Operating System | Windows7 / Windows10 OS 32 bits kana 64 bits |
Kushanda Kwehunyanzvi | |
Resolution | 10.0 lp/mm |
Energy Range | 40 ~ 160 KV |
Lag | 0.01% @1st furemu |
Dynamic Range | ≥ 73dB |
Sensitivity | 100 lsb/uGy |
SNR | 48 dB @(20000lsb) |
MTF | 90% @(1 lp/mm) |
82% @(2 lp/mm) | |
74% @(3 lp/mm) | |
DQE (2uGy) | 65% @(0 lp/mm) |
48% @(1 lp/mm) | |
37% @(2 lp/mm) | |
Mechanical | |
Dimension(H x W x D) | 171 x 171 x 37 mm |
Kurema | 2.8 Kg |
Sensor Dziviriro Material | Carbon Fiber |
Housing Material | Aluminium Alloy |
Environmental | |
Temperature Range | 10 ~ 35 ° ℃ (kushanda);-10 ~ 50 ℃(kuchengeta) |
Humidity | 30 ~ 70% RH (isina-condensing) |
Vibration | IEC/EN 60721-3 kirasi 2M3(10~150 Hz,0.5 g) |
Shock | IEC/EN 60721-3 kirasi 2M3(11 ms,2 g) |
Dust uye Mvura Inodzivirira | IPX0 |
Simba | |
Supply | 100 ~ 240 VAC |
Frequency | 50/60 Hz |
Kushandiswa | 6 W |
Application | |
Industrial | SMT, Electronics, Lithium Battery Chip Wire Bonding Inspection |
Mechanical Dimension | |