18 Years Factory Bone Scan Radiology - Dolphin0606FDI CMOS Industrial X-ray detector – haobo Detail:
Dolphin0606FDI production is a fixed type and low noise x-ray flat panel detector based on CMOS. CMOS sensors use a single crystal silicon process for chip fabrication. Direct integral amplification within pixel cells leads to lower electronic noise, higher signal-to-noise ratio, and higher quantum detection efficiency (DQE) than amorphous silicon, so CMOS sensors are particularly suitable for low-dose imaging scenarios. Based on above characteristics, Dolphin0606FDI detector can be widely used in industrial SMT, electronics, lithium battery and chip wire bonding inspection.
Electronic noise is lower
Higher signal-to-noise ratio
Technology |
|
Sensor |
CMOS |
Scintillator |
CSI |
Active Area |
60 x 53.5 mm |
Pixel Matrix |
1200 x 1056 |
Pixel Pitch |
50 μm |
AD Conversion |
14 bits |
Interface |
|
Communication Interface |
Optical Fiber |
Exposure Control |
Pulse Sync In (Edge or Level) / Pulse Sync Out (Edge or Level) |
Work Mode |
Software Mode / HVG Sync Mode / FPD Sync Mode |
Frame Speed |
51fps (1×1) |
Operating System |
Windows7 / Windows10 OS 32 bits or 64 bits |
Technical Performance |
|
Resolution |
10.0 lp/mm |
Energy Range |
40~160 KV |
Lag |
0.01% @1st frame |
Dynamic Range |
≥ 73dB |
Sensitivity |
100 lsb/uGy |
SNR |
48 dB @(20000lsb) |
MTF |
90% @(1 lp/mm) |
82% @(2 lp/mm) |
|
74% @(3 lp/mm) |
|
DQE (2uGy) |
65% @(0 lp/mm) |
48% @(1 lp/mm) |
|
37% @(2 lp/mm) |
|
Mechanical |
|
Dimension(H x W x D) |
171 x 171 x 37 mm |
Weight |
2.8 Kg |
Sensor Protection Material |
Carbon Fiber |
Housing Material |
Aluminum Alloy |
Environmental |
|
Temperature Range |
10~35°℃ (operating); -10~50℃(storage) |
Humidity |
30~70% RH(non-condensing) |
Vibration |
IEC/EN 60721-3 class 2M3(10~150 Hz,0.5 g) |
Shock |
IEC/EN 60721-3 class 2M3(11 ms,2 g) |
Dust and Water Resistant |
IPX0 |
Power |
|
Supply |
100~240 VAC |
Frequency |
50/60 Hz |
Consumption |
6 W |
Application |
|
Industrial |
SMT, Electronics, Lithium Battery Chip Wire Bonding Inspection |
Mechanical Dimension |
|
Product detail pictures:
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By Pearl Permewan from Macedonia - 2018.06.28 19:27
This supplier's raw material quality is stable and reliable, has always been in accordance with the requirements of our company to provide the goods that quality meet our requirements.
By Sharon from Chicago - 2018.09.23 18:44